BONDING SYSTEM AND BONDING METHOD

• Main Authors: LIU, Tianjian, CHENG, Qu, CAO, Ruixia, TIAN, Yingchao
• Format: Patent
• Language: English; French; German
• Published: 23.08.2023
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

Embodiments of the present disclosure disclose a bonding system and a bonding method. The bonding system includes a bonding assembly, a first alignment assembly, and a second alignment assembly. The bonding assembly includes a bonding head configured to pick a first to-be-bonded die and a first optical path passing through the bonding head, here a first end of the first optical path is located at a picking surface where the bonding head picks the first to-be-bonded die. The first alignment assembly is configured to transmit a detection optical signal to the first end via a second end of the first optical path, when the bonding assembly is located at a first position. The first alignment assembly is further configured to receive a reflection optical signal generated by the first to-be-bonded die reflecting the detection optical signal, and determine a first deviation value between a current position of the first to-be-bonded die and a first target position according to the received reflection optical signal. The second alignment assembly is configured to determine a second deviation value between a current position of a second to-be-bonded die on the wafer and a second target position.