METHODS OF METROLOGY

Disclosed is a method for determining a parameter of interest relating to at least one structure formed on a substrate in a manufacturing process. The method comprises obtaining metrology data relating to a plurality of measurements of the parameter of interest at a respective plurality of measureme...

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Bibliographic Details
Main Authors ZHANG, Huaichen, BATISTAKIS, Chrysostomos
Format Patent
LanguageEnglish
French
German
Published 23.08.2023
Subjects
APPARATUS SPECIALLY ADAPTED THEREFOR
CALCULATING
CINEMATOGRAPHY
COMPUTER SYSTEMS BASED ON SPECIFIC COMPUTATIONAL MODELS
COMPUTING
COUNTING
ELECTROGRAPHY
HOLOGRAPHY
IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
MATERIALS THEREFOR
ORIGINALS THEREFOR
PHOTOGRAPHY
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES
PHYSICS
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Summary:Disclosed is a method for determining a parameter of interest relating to at least one structure formed on a substrate in a manufacturing process. The method comprises obtaining metrology data relating to a plurality of measurements of the parameter of interest at a respective plurality of measurement locations on the substrate and layout data relating to a layout of a pattern to be applied to said structure, said pattern comprising said at least one structure. The method comprises determining a value for a parameter of interest at one or more locations on the substrate different from said measurement locations from said metrology data and layout data using a trained model, having been trained to be able to interpolate said metrology data using said layout data to an expected value for the parameter of interest.
Bibliography:Application Number: EP20220157745