COMMUNICATION BETWEEN INTEGRATED CIRCUIT (1C) DIES IN WAFER- LEVEL FAN-OUT PACKAGE

• Main Authors: POON, Chi Fung, LARABA, Asma, UPADHYAYA, Parag
• Format: Patent
• Language: English; French; German
• Published: 09.08.2023
• Subjects: BASIC ELECTRIC ELEMENTS; BASIC ELECTRONIC CIRCUITRY; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; PULSE TECHNIQUE; SEMICONDUCTOR DEVICES

Examples described herein generally relate to communication between integrated circuit (IC) dies in a wafer-level fan-out package. In an example, an electronic device includes a wafer-level fan-out package. The wafer-level fan-out package includes a first integrated circuit (IC) die, a second IC die...