QUANTUM CHIP AND PREPARATION METHOD

The present application discloses a quantum chip and a fabrication method therefor, and the quantum chip includes a base substrate on which signal transmission lines are formed; and at least one insulating substrate located on the base substrate, where a qubit and a through hole penetrating through...

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Bibliographic Details
Main Authors YOU, Bing, MA, Liangliang, WANG, Nianci, ZHENG, Jie, LIU, Wenshu
Format Patent
LanguageEnglish
French
German
Published 29.05.2024
Subjects
CALCULATING
COMPUTER SYSTEMS BASED ON SPECIFIC COMPUTATIONAL MODELS
COMPUTING
COUNTING
ELECTRICITY
PHYSICS
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Summary:The present application discloses a quantum chip and a fabrication method therefor, and the quantum chip includes a base substrate on which signal transmission lines are formed; and at least one insulating substrate located on the base substrate, where a qubit and a through hole penetrating through the insulating substrate are formed on the insulating substrate, a metal piece is formed in the through hole, and two ends of the metal piece are electrically connected to the signal transmission lines and the qubit, respectively, such that signal transmission between the signal transmission lines and the qubit is implemented and a qubit complete circuit located on different layers is formed, and a plurality of insulating substrates that are stacked are used for forming qubits located on insulating substrates in different layers, thereby expanding a quantity of the qubits to an enough amount. In this way, an integration degree of a quantum chip is improved.
Bibliography:Application Number: EP20220766130