SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF FORMING

A semiconductor device package (100), (200) comprises a semiconductor switching device (12) having a body (13), the body (13) including a first side (13a), and a second side (13b) opposing the first side (13a) coupled to a substrate (14). A gate terminal (35) is defined on the semiconductor switchin...

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Bibliographic Details
Main Author GOWDA, Arun Virupaksha
Format Patent
LanguageEnglish
French
German
Published 26.07.2023
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A semiconductor device package (100), (200) comprises a semiconductor switching device (12) having a body (13), the body (13) including a first side (13a), and a second side (13b) opposing the first side (13a) coupled to a substrate (14). A gate terminal (35) is defined on the semiconductor switching device first side (13a), the gate terminal (35) having a first side (35a), and a second side (35b) opposing the first side (35a) and facing the body (13). A first gate resistor (15) is disposed on the gate terminal first side (35a), and coupled electrically in series with the gate terminal (35).
Bibliography:Application Number: EP20230151822