APPARATUS AND METHOD FOR CUTTING A SUBSTRATE
The present invention relates to an apparatus and a process for cutting a substrate wherein the apparatus comprises first and second cutting element and wherein the first and second cutting elements are rotatable about the axis of rotation at different circumferential speeds.
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Main Authors | , |
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Format | Patent |
Language | English French German |
Published |
26.07.2023
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Subjects | |
Online Access | Get full text |
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Abstract | The present invention relates to an apparatus and a process for cutting a substrate wherein the apparatus comprises first and second cutting element and wherein the first and second cutting elements are rotatable about the axis of rotation at different circumferential speeds. |
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AbstractList | The present invention relates to an apparatus and a process for cutting a substrate wherein the apparatus comprises first and second cutting element and wherein the first and second cutting elements are rotatable about the axis of rotation at different circumferential speeds. |
Author | BUSCH, James William BITTNER, Dale Francis |
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Discipline | Medicine Chemistry Sciences |
DocumentTitleAlternate | VORRICHTUNG UND VERFAHREN ZUM SCHNEIDEN EINES SUBSTRATS APPAREIL ET PROCÉDÉ DE DÉCOUPE D'UN SUBSTRAT |
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PublicationDateYYYYMMDD | 2023-07-26 |
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PublicationYear | 2023 |
RelatedCompanies | The Procter & Gamble Company |
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Snippet | The present invention relates to an apparatus and a process for cutting a substrate wherein the apparatus comprises first and second cutting element and... |
SourceID | epo |
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SubjectTerms | CUTTING DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING,CUTTING-OUT, STAMPING-OUT OR SEVERING HAND CUTTING TOOLS PERFORMING OPERATIONS SEVERING TRANSPORTING |
Title | APPARATUS AND METHOD FOR CUTTING A SUBSTRATE |
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