APPARATUS AND METHOD FOR CUTTING A SUBSTRATE

The present invention relates to an apparatus and a process for cutting a substrate wherein the apparatus comprises first and second cutting element and wherein the first and second cutting elements are rotatable about the axis of rotation at different circumferential speeds.

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Bibliographic Details
Main Authors BUSCH, James William, BITTNER, Dale Francis
Format Patent
LanguageEnglish
French
German
Published 26.07.2023
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Abstract The present invention relates to an apparatus and a process for cutting a substrate wherein the apparatus comprises first and second cutting element and wherein the first and second cutting elements are rotatable about the axis of rotation at different circumferential speeds.
AbstractList The present invention relates to an apparatus and a process for cutting a substrate wherein the apparatus comprises first and second cutting element and wherein the first and second cutting elements are rotatable about the axis of rotation at different circumferential speeds.
Author BUSCH, James William
BITTNER, Dale Francis
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DocumentTitleAlternate VORRICHTUNG UND VERFAHREN ZUM SCHNEIDEN EINES SUBSTRATS
APPAREIL ET PROCÉDÉ DE DÉCOUPE D'UN SUBSTRAT
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RelatedCompanies The Procter & Gamble Company
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Snippet The present invention relates to an apparatus and a process for cutting a substrate wherein the apparatus comprises first and second cutting element and...
SourceID epo
SourceType Open Access Repository
SubjectTerms CUTTING
DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING,CUTTING-OUT, STAMPING-OUT OR SEVERING
HAND CUTTING TOOLS
PERFORMING OPERATIONS
SEVERING
TRANSPORTING
Title APPARATUS AND METHOD FOR CUTTING A SUBSTRATE
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