APPARATUS AND METHOD FOR CUTTING A SUBSTRATE

The present invention relates to an apparatus and a process for cutting a substrate wherein the apparatus comprises first and second cutting element and wherein the first and second cutting elements are rotatable about the axis of rotation at different circumferential speeds.

Saved in:
Bibliographic Details
Main Authors BUSCH, James William, BITTNER, Dale Francis
Format Patent
LanguageEnglish
French
German
Published 26.07.2023
Subjects
CUTTING
DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING,CUTTING-OUT, STAMPING-OUT OR SEVERING
HAND CUTTING TOOLS
PERFORMING OPERATIONS
SEVERING
TRANSPORTING
Online AccessGet full text

Cover

More Information
Summary:The present invention relates to an apparatus and a process for cutting a substrate wherein the apparatus comprises first and second cutting element and wherein the first and second cutting elements are rotatable about the axis of rotation at different circumferential speeds.
Bibliography:Application Number: EP20220153098