ALUMINUM WIRING MATERIAL

There is provided a novel Al wiring material that achieves a favorable high-temperature reliability as well as a favorable workability and bondability during installation and connection to a device. The Al wiring material contains Mg and Si so as to satisfy 0.05 ≤ x1a ≤ 2.5, 0.02 ≤ x1b ≤ 1, and 0.1...

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Bibliographic Details
Main Authors OISHI, Ryo, OYAMADA, Tetsuya, ODA, Daizo, UNO, Tomohiro, SUTO, Yuya, KURIHARA, Yuto
Format Patent
LanguageEnglish
French
German
Published 05.07.2023
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:There is provided a novel Al wiring material that achieves a favorable high-temperature reliability as well as a favorable workability and bondability during installation and connection to a device. The Al wiring material contains Mg and Si so as to satisfy 0.05 ≤ x1a ≤ 2.5, 0.02 ≤ x1b ≤ 1, and 0.1 ≤ (x1a + x1b) ≤ 3 where x1a is a content of Mg [% by mass] and x1b is a content of Si [% by mass], and contains one or more selected from the group consisting of Sc, Er, Yb, Gd, Ce and Y so as to satisfy 0.001 ≤ x2 ≤ 0.5 where x2 is a total content thereof [% by mass], with the balance comprising Al.
Bibliography:Application Number: EP20210861559