SEMICONDUCTOR DEVICE, AND PREPARATION METHOD THEREFOR AND USE THEREOF

The embodiments of the disclosure relate to the technical field of the semiconductor, and specifically disclose a semiconductor device, a method for manufacturing it and an application thereof. The semiconductor device includes a substrate; a semiconductor material layer located on the substrate and...

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Bibliographic Details
Main Author LEE, Tzung-han
Format Patent
LanguageEnglish
French
German
Published 21.06.2023
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:The embodiments of the disclosure relate to the technical field of the semiconductor, and specifically disclose a semiconductor device, a method for manufacturing it and an application thereof. The semiconductor device includes a substrate; a semiconductor material layer located on the substrate and covering a part of the substrate; a gate located on the semiconductor material layer and the substrate not covered by the semiconductor material layer; in which, along an extending direction of the gate, a width of the semiconductor material layer is smaller than a width of the substrate, and a carrier mobility of a material of the semiconductor material layer is different from a carrier mobility of a material of the substrate.
Bibliography:Application Number: EP20220712487