SOLID-STATE IMAGING DEVICE, METHOD FOR MANUFACTURING SOLID-STATE IMAGING DEVICE, AND ELECTRONIC APPARATUS

• Main Authors: OTSUKA, Yasushi, KANATAKE, Mitsuhito, DONG, Wenshuang, AOKI, Shumpei
• Format: Patent
• Language: English; French; German
• Published: 07.06.2023
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC COMMUNICATION TECHNIQUE; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; PICTORIAL COMMUNICATION, e.g. TELEVISION; SEMICONDUCTOR DEVICES

A solid-state imaging apparatus is provided that, in a configuration including a mold resin portion formed around an image sensor and cover glass, enables potential burrs of the mold resin on a cover glass surface to be prevented without the need for a dedicated mold, the cover glass having a light blocking effect, and a method for manufacturing the solid-state imaging apparatus and electronic equipment are also provided.The solid-state imaging apparatus includes a substrate, an image sensor provided on the substrate, a transparent member provided on the image sensor via a support portion, and a mold resin portion formed around the image sensor and the transparent member on the substrate, and a front surface, a side surface, or a back surface of the transparent member is provided with a groove portion in a region outside a light receiving area of the image sensor. Furthermore, to eliminate the adverse effect of light reflected to an inner side surface of the groove portion, a V-shaped groove portion is formed, and the inner side surface of the V-shaped groove portion has an angle defined as half of a maximum refracting angle or larger.