FILM THICKNESS UNIFORMITY IMPROVEMENT USING EDGE RING AND BIAS ELECTRODE GEOMETRY

Embodiments of the present disclosure generally relate to the fabrication of integrated circuits and to apparatus for use within a substrate processing chamber to improve film thickness uniformity. More specifically, the embodiments of the disclosure relate to an edge ring. The edge ring may include...

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Bibliographic Details
Main Authors NAGORNY, Vladimir, ABRAHAM, Jacob, BEHERA, Swayambhu Prasad, LO, Kin Pong, GUARINI, Theresa Kramer, BEVAN, Malcolm J, HWANG, Bernard L, LIU, Wei
Format Patent
LanguageEnglish
French
German
Published 07.06.2023
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
ELECTRICITY
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Summary:Embodiments of the present disclosure generally relate to the fabrication of integrated circuits and to apparatus for use within a substrate processing chamber to improve film thickness uniformity. More specifically, the embodiments of the disclosure relate to an edge ring. The edge ring may include an overhang ring.
Bibliography:Application Number: EP20200946791