HEAT DISSIPATION CABINET AND COMMUNICATION APPARATUS

• Main Authors: CHEN, Jie, YAN, Tao, LIU, Qingying, YANG, Zhiwen, ZOU, Henglong
• Format: Patent
• Language: English; French; German
• Published: 31.05.2023
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

This application relates to a heat dissipation cabinet and a communications device. A first accommodation region (409) of a cabinet body (400) can accommodate a plugboard (200) in a stacked manner, and heat source components (201) of the plugboard (200) dissipate heat through a heat dissipation apparatus (100). An evaporator (10), a condenser (20), and an evaporation pipeline (30) of the heat dissipation apparatus (100) are connected to a liquid return pipeline (40) to form a heat exchange loop, and the evaporator (10) is in thermal contact with an outer surface of a heat source component (201). The condenser (20) is disposed in a second accommodation region and located above the evaporator (10). Refrigerating working substances circularly flow in the heat exchange loop, to draw the heat of the heat source component (201) far to the condenser (20), and rapidly take away the heat of the condenser (20) by using air generated by a fan (50), thereby implementing centralized heat dissipation. A second accommodation region (410) is used as an independent air duct, and a path of the air duct is relatively short. This may improve an air amount, and reduce resistance of a system. A volume of the condenser (20) is increased, a heat dissipation area of convective heat exchange is enlarged, and a heat dissipation capability is improved. The condenser (20) is removed out of the plugboard (200) and used as a heat dissipation resource pool, to overcome a case in which a heat dissipation area of a heat sink is constrained by slot space and heat dissipation is poor due to uneven air amounts in a slot.