PACKAGE-LEVEL ESD PROTECTION

The present invention provides a package (100) including a first pad (N1), a die (110), and at least one package ESD component (120, 130, 140). The first pad (N1) is configured to receive a signal from a device external to the package (100) . The die (110) comprises a second pad (N2) and an internal...

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Bibliographic Details
Main Authors LIAO, Yu-Cheng, HUANG, Bo-Shih, LIN, Yi-Chieh, JAO, Che-Yuan
Format Patent
LanguageEnglish
French
German
Published 05.07.2023
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:The present invention provides a package (100) including a first pad (N1), a die (110), and at least one package ESD component (120, 130, 140). The first pad (N1) is configured to receive a signal from a device external to the package (100) . The die (110) comprises a second pad (N2) and an internal circuit (112), wherein the internal circuit (112) is configured to receive the signal from the first pad (N1) via the second pad (N2).
Bibliography:Application Number: EP20220194221