BUS BAR ASSEMBLY AND METHOD FOR MANUFACTURING SAME

A busbar assembly of the present invention includes plural conductive busbars (10(1)-(3)) disposed in a common plane with a gap (19), an insulative resin film (20) bonded to upper surfaces of the plural busbars (10(1)-(3)) in a manner to straddle the gap (19), and a rigid frame body (30) bonded to a...

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Bibliographic Details
Main Author KOBAYAKAWA, Hiroya
Format Patent
LanguageEnglish
French
German
Published 13.03.2024
Subjects
BASIC ELECTRIC ELEMENTS
CABLES
CONDUCTORS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
INSULATORS
SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES
SEMICONDUCTOR DEVICES
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Summary:A busbar assembly of the present invention includes plural conductive busbars (10(1)-(3)) disposed in a common plane with a gap (19), an insulative resin film (20) bonded to upper surfaces of the plural busbars (10(1)-(3)) in a manner to straddle the gap (19), and a rigid frame body (30) bonded to an upper surface of the insulative resin film (20). The frame body (30) is so configured as to be along a peripheral edge area in plan view of a busbar connected body in which the plural busbars (10(1)-(3)) are connected to one another by the insulative resin film (20). The insulative resin film (20) is formed with an opening (21-23) that exposes a predetermined area of the upper surface of the plural busbars (10(1)-(3)).
Bibliography:Application Number: EP20200944347