LEADFRAME CAPACITORS

An electronic device having a package structure with conductive leads, first and second dies in the package structure, as well as first and second conductive plates electrically coupled to the respective first and second dies and having respective first and second sides spaced apart from and directl...

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Bibliographic Details
Main Authors SINGH, Tarunvir, NASUM, Sreeram, Subramanyam, KHANOLKAR, Vijaylaximi
Format Patent
LanguageEnglish
French
German
Published 20.12.2023
Subjects
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Summary:An electronic device having a package structure with conductive leads, first and second dies in the package structure, as well as first and second conductive plates electrically coupled to the respective first and second dies and having respective first and second sides spaced apart from and directly facing one another with a portion of the package structure extending between the first side of the first conductive plate and the second side of the second conductive plate to form a capacitor. No other side of the first conductive plate directly faces a side of the second conductive plate, and no other side of the second conductive plate directly faces a side of the first conductive plate.
Bibliography:Application Number: EP20210826874