SEMICONDUCTOR PACKAGES WITH ANTENNAS

An antenna package, comprising a plurality of dielectric redistribution layers, an interface layer on the top side of the plurality of dielectric redistribution layers, a die above the interface layer, a first dielectric layer on the bottom side of the plurality of dielectric redistribution layers,...

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Bibliographic Details
Main Authors KAMGAING, Telesphor, ELSHERBINI, Adel, OSTER, Sasha
Format Patent
LanguageEnglish
French
German
Published 12.04.2023
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:An antenna package, comprising a plurality of dielectric redistribution layers, an interface layer on the top side of the plurality of dielectric redistribution layers, a die above the interface layer, a first dielectric layer on the bottom side of the plurality of dielectric redistribution layers, a via in the first dielectric layer, a first antenna element coupled to the via, a second dielectric layer on the first dielectric layer and on the first antenna element, a second antenna element on the second dielectric layer, the second antenna element vertically beneath the first antenna element, and a third dielectric layer on the second dielectric layer and on the second antenna element.
Bibliography:Application Number: EP20220205663