DIPPING APPARATUS, DIE BONDING APPARATUS, AND MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE

• Main Authors: KATO, Takahiro, SAKAI, Kazunobu, LEE, Geonju
• Format: Patent
• Language: English; French; German
• Published: 12.04.2023
• Subjects: APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL; APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL; BASIC ELECTRIC ELEMENTS; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR; PERFORMING OPERATIONS; SEMICONDUCTOR DEVICES; SOLDERING OR UNSOLDERING; SPRAYING OR ATOMISING IN GENERAL; TRANSPORTING; WELDING; WORKING BY LASER BEAM

A die bonding apparatus comprising: a dipping apparatus (8, 31_2) and a control device (7) configured to control the dipping apparatus, wherein the dipping apparatus comprises a squeegee device (81) and a plate (82p) for forming a flux film out of flux. A surface of the plate has a rough surface (RS) with a nano-level arithmetically average roughness. The dipping apparatus is configured in such a way that the squeegee device and the plate are moved relatively to each other, and the flux is fed from the squeegee device to the rough surface of the plate.