PIEZOELECTRIC ASSEMBLY AND PROCESS OF FORMING A PIEZOELECTRIC ASSEMBLY

Piezoelectric assembly, which comprises a substrate of Ni, Cu, or steel, a first oriented layer assembled on the substrate and a piezoelectric layer on the oriented layer. The piezoelectric layer has a degree of (100) orientation with respect to the local surface normal of 90% or more.

Saved in:
Bibliographic Details
Main Authors VRABELJ, Marko, REDOLFI, Sebastian
Format Patent
LanguageEnglish
French
German
Published 12.04.2023
Subjects
ELECTRICITY
Online AccessGet full text

Cover

More Information
Summary:Piezoelectric assembly, which comprises a substrate of Ni, Cu, or steel, a first oriented layer assembled on the substrate and a piezoelectric layer on the oriented layer. The piezoelectric layer has a degree of (100) orientation with respect to the local surface normal of 90% or more.
Bibliography:Application Number: EP20210730873