BACK SIDE POWER SUPPLY FOR ELECTRONIC DEVICES

A semiconductor device is disclosed, comprising a first semiconductor die comprising a plurality of transistors; a second semiconductor die comprising power supply circuitry configured to generate a supply voltage for the plurality of transistors of the first semiconductor die; and a heat spreader s...

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Bibliographic Details
Main Authors MOLZER, Wolfgang, HEROLD, Klaus, BAUMGARTNER, Peter, WAGNER, Thomas, LANGENBUCH, Michael, SINGER, Joachim, WAIDHAS, Bernd
Format Patent
LanguageEnglish
French
German
Published 29.03.2023
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A semiconductor device is disclosed, comprising a first semiconductor die comprising a plurality of transistors; a second semiconductor die comprising power supply circuitry configured to generate a supply voltage for the plurality of transistors of the first semiconductor die; and a heat spreader structure. A power supply routing for a reference voltage or a power supply voltage extends from the heat spreader structure through the second semiconductor die to the first semiconductor die.
Bibliography:Application Number: EP20220197147