METHOD OF BONDING THERMOPLASTIC RESIN AND METAL

• Main Authors: WASHIKA, Kiminori, KAWAFUCHI, Tatsumi
• Format: Patent
• Language: English; French; German
• Published: 28.02.2024
• Subjects: AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR; PERFORMING OPERATIONS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR; SHAPING OR JOINING OF PLASTICS; SOLDERING OR UNSOLDERING; TRANSPORTING; WELDING; WORKING BY LASER BEAM; WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

Provided is a simple method for directly bonding thermoplastic resin materials together or directly bonding a thermoplastic resin material and a metal material without using an adhesive, rivet fastening, or the like, wherein the method of directly bonding a metal and a thermoplastic resin can be applied without restriction to the size and shape of the materials being bonded, and makes it possible to efficiently produce large quantities of homogeneous, high-strength bondings without including any wet steps. This method of metal-thermoplastic resin direct bonding is a method of directly bonding a metal material and a thermoplastic resin material, wherein the method is characterized by comprising a first step for irradiating a surface of the metal material with a pulse laser under an oxidizing atmosphere to form a surface modification region, a second step for causing the thermoplastic resin material to abut against the surface modification region to form a bonding interface, and a third step for heating up the bonding interface by laser irradiation to achieve bonding, the first step including forming metal oxide particle clusters obtained when metal oxide particles having a particle diameter of 5-500 nm to be continuously bonded at the surface modification region, so that the maximum height (Sz) of a surface of the metal oxide particle clusters is 50 nm-3 µm.