INDEPENDENTLY-ADDRESSABLE HIGH POWER SURFACE-EMITTING LASER ARRAY WITH TIGHT-PITCH PACKING
A semiconductor surface-emitting laser array can be provided with a group of independently addressable light-emitting pixels arranged in at least two rows and in a linear array on a common substrate chip and including a common cathode and a dedicated channel associated with an address trace line for...
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Main Authors | , , , , , |
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Format | Patent |
Language | English French German |
Published |
01.03.2023
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Subjects | |
Online Access | Get full text |
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Summary: | A semiconductor surface-emitting laser array can be provided with a group of independently addressable light-emitting pixels arranged in at least two rows and in a linear array on a common substrate chip and including a common cathode and a dedicated channel associated with an address trace line for each pixel. An aggregate linear pitch can be achieved between pixels of the at least two rows along the linear array in a cross process direction that is less than the size of a pixel. The semiconductor laser array can include more than one common substrate chip tiled and stitched together in a staggered arrangement to provide an at least 11-inch wide, 1200pdi imager with timing delays associated with each of the more than one common substrate chip in the staggered arrangement. |
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Bibliography: | Application Number: EP20220189001 |