METHOD FOR PRODUCING POWER SEMICONDUCTOR MODULE AND POWER SEMICONDUCTOR MODULE

A method for producing a power semiconductor module is disclosed, including: packaging a power device in plastic to form a power semiconductor component, and forming a first heat dissipation face on a surface of the power semiconductor component; heating a first material between a first heat sink an...

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Bibliographic Details
Main Authors DU, Ruoyang, WU, Wei, LV, Zhen, WU, Bingzhi, GUO, Chaoyang
Format Patent
LanguageEnglish
French
German
Published 22.02.2023
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A method for producing a power semiconductor module is disclosed, including: packaging a power device in plastic to form a power semiconductor component, and forming a first heat dissipation face on a surface of the power semiconductor component; heating a first material between a first heat sink and the first heat dissipation face; and cooling the first material on the first heat dissipation face to connect the power semiconductor component and the first heat sink. According to the method for producing a power semiconductor module, the power semiconductor module is produced through plastic packaging and then soldering, so that the power semiconductor module has better integrity and higher waterproof performance. When the first heat sink of the power semiconductor module takes away heat through liquid cooling, a coolant does not easily penetrate into the power semiconductor component of the power semiconductor module, and sealing performance may be detected in advance, to improve reliability. This application further provides a power semiconductor module.
Bibliography:Application Number: EP20220190612