COPPER BASE SUBSTRATE

A copper base substrate of the present invention, in which a copper substrate, an insulating layer, and a circuit layer, are laminated in an order in the copper substrate, a ratio of a thickness (unit: µm) to an elastic modulus (unit: GPa) at 100°C is 50 or more in the insulating layer, and the circ...

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Bibliographic Details
Main Authors HARA, Shintaro, ISHIKAWA, Fumiaki
Format Patent
LanguageEnglish
French
German
Published 17.04.2024
Subjects
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
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Summary:A copper base substrate of the present invention, in which a copper substrate, an insulating layer, and a circuit layer, are laminated in an order in the copper substrate, a ratio of a thickness (unit: µm) to an elastic modulus (unit: GPa) at 100°C is 50 or more in the insulating layer, and the circuit layer has an elastic modulus at 100°C of 100 GPa or less.
Bibliography:Application Number: EP20210781993