POLYIMIDE BONDED BUS BAR FOR POWER DEVICE
Disclosed is a semiconductor article including: a metal bus bar (15) and a metal heat sink (40) wherein at least a portion of a first side of the metal bus bar is bonded to at least a portion of the metal heat sink by a polyimide layer without adhesive; and a semiconductor power device (10) disposed...
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Main Author | |
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Format | Patent |
Language | English French German |
Published |
04.01.2023
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Subjects | |
Online Access | Get full text |
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Abstract | Disclosed is a semiconductor article including: a metal bus bar (15) and a metal heat sink (40) wherein at least a portion of a first side of the metal bus bar is bonded to at least a portion of the metal heat sink by a polyimide layer without adhesive; and a semiconductor power device (10) disposed on a second side of the metal bus bar. |
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AbstractList | Disclosed is a semiconductor article including: a metal bus bar (15) and a metal heat sink (40) wherein at least a portion of a first side of the metal bus bar is bonded to at least a portion of the metal heat sink by a polyimide layer without adhesive; and a semiconductor power device (10) disposed on a second side of the metal bus bar. |
Author | FENG, Frank Z |
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Discipline | Medicine Chemistry Sciences |
DocumentTitleAlternate | POLYIMIDGEBUNDENE SAMMELSCHIENE FÜR STROMVORRICHTUNG BARRE OMNIBUS LIÉE AU POLYIMIDE POUR DISPOSITIF DE PUISSANCE |
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Notes | Application Number: EP20220182395 |
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PublicationYear | 2023 |
RelatedCompanies | Hamilton Sundstrand Corporation |
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Snippet | Disclosed is a semiconductor article including: a metal bus bar (15) and a metal heat sink (40) wherein at least a portion of a first side of the metal bus bar... |
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SubjectTerms | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
Title | POLYIMIDE BONDED BUS BAR FOR POWER DEVICE |
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