POLYIMIDE BONDED BUS BAR FOR POWER DEVICE

Disclosed is a semiconductor article including: a metal bus bar (15) and a metal heat sink (40) wherein at least a portion of a first side of the metal bus bar is bonded to at least a portion of the metal heat sink by a polyimide layer without adhesive; and a semiconductor power device (10) disposed...

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Bibliographic Details
Main Author FENG, Frank Z
Format Patent
LanguageEnglish
French
German
Published 04.01.2023
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:Disclosed is a semiconductor article including: a metal bus bar (15) and a metal heat sink (40) wherein at least a portion of a first side of the metal bus bar is bonded to at least a portion of the metal heat sink by a polyimide layer without adhesive; and a semiconductor power device (10) disposed on a second side of the metal bus bar.
Bibliography:Application Number: EP20220182395