PACKAGE COMPRISING A SUBSTRATE CONFIGURED AS A HEAT SPREADER

A package that includes a first substrate, an integrated device coupled to the first substrate, a second substrate coupled to the integrated device, and an encapsulation layer located between the first substrate and the second substrate. The second substrate is configured to operate as a heat spread...

Full description

Saved in:
Bibliographic Details
Main Authors SODHI, Avantika, HSU, Marcus, KANG, Kuiwon, RAE, David Fraser, HOLMES, John
Format Patent
LanguageEnglish
French
German
Published 21.12.2022
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online AccessGet full text

Cover

More Information
Summary:A package that includes a first substrate, an integrated device coupled to the first substrate, a second substrate coupled to the integrated device, and an encapsulation layer located between the first substrate and the second substrate. The second substrate is configured to operate as a heat spreader. The second substrate is configured to be free of an electrical connection with the integrated device.
Bibliography:Application Number: EP20210704348