PROCESS FOR MANUFACTURING A COMBINED MICROELECTROMECHANICAL DEVICE AND CORRESPONDING COMBINED MICROELECTROMECHANICAL DEVICE

• Main Authors: VERCESI, Federico, CORSO, Lorenzo, OGGIONI, Laura, SEGHIZZI, Luca
• Format: Patent
• Language: English; French; German
• Published: 03.04.2024
• Subjects: MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES; MICROSTRUCTURAL TECHNOLOGY; PERFORMING OPERATIONS; PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS; TRANSPORTING

A process for manufacturing a combined microelectromechanical device (30) provides for: forming, in a die (1) of semiconductor material, at least a first (2a) and a second (2b) microelectromechanical structures; performing a first bonding phase to bond a cap (10) to the die (1) by means of a bonding region (14), to define at least a first (20a) and a second (20b) cavity at the first and, respectively, second microelectromechanical structures, the cavities being at a controlled pressure having a first value; forming an access channel (22) through the cap in fluidic communication with the first cavity to control the pressure value inside the first cavity in a distinct manner with respect to a respective pressure value inside the second cavity; performing a second bonding phase, after which the bonding region deforms to hermetically close the first cavity with respect to the access channel.