DEEP BRAIN STIMULATION LEAD

The present disclosure discusses a system and methods for a deep brain stimulation lead. More particularly, the disclosure discusses a stimulation lead that includes one or more silicon based barrier layers within a MEMS film. The silicon based barrier layers can improve device reliability and durab...

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Bibliographic Details
Main Authors BOERS, Marc, DRANSART, Alain, MERCANZINI, Andre, JORDAN, Alain, MICHALIS, Alexandre
Format Patent
LanguageEnglish
French
German
Published 30.11.2022
Subjects
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Summary:The present disclosure discusses a system and methods for a deep brain stimulation lead. More particularly, the disclosure discusses a stimulation lead that includes one or more silicon based barrier layers within a MEMS film. The silicon based barrier layers can improve device reliability and durability. The silicon based barrier layers can also improve adhesion between the layers of the MEMS film.
Bibliography:Application Number: EP20220176763