DEEP BRAIN STIMULATION LEAD
The present disclosure discusses a system and methods for a deep brain stimulation lead. More particularly, the disclosure discusses a stimulation lead that includes one or more silicon based barrier layers within a MEMS film. The silicon based barrier layers can improve device reliability and durab...
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Main Authors | , , , , |
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Format | Patent |
Language | English French German |
Published |
30.11.2022
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Subjects | |
Online Access | Get full text |
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Summary: | The present disclosure discusses a system and methods for a deep brain stimulation lead. More particularly, the disclosure discusses a stimulation lead that includes one or more silicon based barrier layers within a MEMS film. The silicon based barrier layers can improve device reliability and durability. The silicon based barrier layers can also improve adhesion between the layers of the MEMS film. |
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Bibliography: | Application Number: EP20220176763 |