DENSELY PACKED VCSEL ARRAY
The present disclosure relates to the field of Vertical Cavity Surface Emitting Lasers (VCSELs) and in particular to a semiconductor device (1) comprising an array of vertical cavity surface emitting lasers (10, 11, 12, 13), VCSELs, wherein the semiconductor device comprises::a first VCSEL (10) havi...
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Main Authors | , |
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Format | Patent |
Language | English French German |
Published |
23.11.2022
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Subjects | |
Online Access | Get full text |
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Summary: | The present disclosure relates to the field of Vertical Cavity Surface Emitting Lasers (VCSELs) and in particular to a semiconductor device (1) comprising an array of vertical cavity surface emitting lasers (10, 11, 12, 13), VCSELs, wherein the semiconductor device comprises::a first VCSEL (10) having a first active area (20); a second VCSEL (11) having a second active area (21); a bridge ((31, 31') connecting the first VCSEL and the second VCSEL; wherein the first active area of the first VCSEL and the second active area of the second VCSEL are arranged along a first crystal axis (2); and a blocking structure (41) arranged between the first VCSEL (10) and the second VCSEL (11), wherein the blocking structure is adapted to block a propagation of a defect between the first VCSEL and the second VCSEL along the first crystal axis (2). |
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Bibliography: | Application Number: EP20210175109 |