DENSELY PACKED VCSEL ARRAY

The present disclosure relates to the field of Vertical Cavity Surface Emitting Lasers (VCSELs) and in particular to a semiconductor device (1) comprising an array of vertical cavity surface emitting lasers (10, 11, 12, 13), VCSELs, wherein the semiconductor device comprises::a first VCSEL (10) havi...

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Bibliographic Details
Main Authors PRUIJMBOOM, Armand, WEIGL, Alexander
Format Patent
LanguageEnglish
French
German
Published 23.11.2022
Subjects
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Summary:The present disclosure relates to the field of Vertical Cavity Surface Emitting Lasers (VCSELs) and in particular to a semiconductor device (1) comprising an array of vertical cavity surface emitting lasers (10, 11, 12, 13), VCSELs, wherein the semiconductor device comprises::a first VCSEL (10) having a first active area (20); a second VCSEL (11) having a second active area (21); a bridge ((31, 31') connecting the first VCSEL and the second VCSEL; wherein the first active area of the first VCSEL and the second active area of the second VCSEL are arranged along a first crystal axis (2); and a blocking structure (41) arranged between the first VCSEL (10) and the second VCSEL (11), wherein the blocking structure is adapted to block a propagation of a defect between the first VCSEL and the second VCSEL along the first crystal axis (2).
Bibliography:Application Number: EP20210175109