DEVICE CARRIER CONFIGURED FOR INTERCONNECTS, A PACKAGE IMPLEMENTING A DEVICE CARRIER HAVING INTERCONNECTS, AND PROCESSES OF MAKING THE SAME

• Main Authors: KOMPOSCH, Alexander, CHIDURALA, Madhu, WARD, Simon
• Format: Patent
• Language: English; French; German
• Published: 28.02.2024
• Subjects: AMPLIFIERS; BASIC ELECTRIC ELEMENTS; BASIC ELECTRONIC CIRCUITRY; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES

An RF transistor package includes a metal submount; a transistor die mounted to the metal submount; and a surface mount IPD component mounted to the metal submount. The surface mount IPD component includes a dielectric substrate that includes a top surface and a bottom surface and at least a first pad and a second pad arranged on a top surface of the surface mount IPD component; at least one surface mount device includes a first terminal and a second terminal, the first terminal of the surface mount device mounted to the first pad and the second terminal mounted to the second pad; at least one of the first terminal and the second terminal being configured to be isolated from the metal submount by the dielectric substrate; and at least one wire bond bonded to the at least one of the first pad and the second pad.