LIGHT-EMITTING DIODE CHIP STRUCTURE

A light-emitting diode chip structure comprising a substrate (10); a metal contact layer (20) disposed on the substrate (10); a light-emitting semiconductor layer (30) disposed on the metal contact layer (20); an insulating protective layer (40) covering the metal contact layer (20) and the light-em...

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Bibliographic Details
Main Authors CHEN, Fu-Bang, HUANG, Kuo-Hsin
Format Patent
LanguageEnglish
French
German
Published 16.11.2022
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A light-emitting diode chip structure comprising a substrate (10); a metal contact layer (20) disposed on the substrate (10); a light-emitting semiconductor layer (30) disposed on the metal contact layer (20); an insulating protective layer (40) covering the metal contact layer (20) and the light-emitting diode semiconductor layer. The insulating protective layer (40) includes a first opening (41) that exposes the light-emitting semiconductor layer (30) and a second opening (42) that exposes the metal contact layer (20). The metal conductive layer (50) with one end passing through the first opening (41) to be electrically connected to the light-emitting semiconductor layer (30), and the other end of the metal conductive layer (50) extended on the insulating protective layer (40). A first electrode pad (60) and a second electrode pad (70) are respectively located on lateral sides of the light-emitting semiconductor layer (30) and respectively disposed on the metal conductive layer (50) and passing through the second opening (42) to be disposed on the metal contact layer (20).
Bibliography:Application Number: EP20210173205