HEAT DISSIPATION DEVICE, CIRCUIT BOARD ASSEMBLY, AND ELECTRONIC APPARATUS

• Main Authors: WEI, Longhe, CHEN, Jun, LI, Quanming, LIAN, Zhisheng
• Format: Patent
• Language: English; French; German
• Published: 28.06.2023
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

Embodiments of this application provide a heat dissipation apparatus, a circuit board assembly, and an electronic device. The heat dissipation apparatus is applicable to a circuit board, where a plurality of heating elements are disposed on the circuit board, the heat dissipation apparatus includes a substrate, at least one heat conductor is disposed on one surface that is of the substrate and that faces the circuit board, one end of the heat conductor is connected to the substrate, and the other end extends toward the circuit board and is close to the heating elements. At least one heat conductor is disposed on the one surface that is of the substrate and that faces the circuit board, one end of the heat conductor is connected to the substrate, and the other end of the heat conductor extends toward the circuit board and is close to the heating elements. In this case, heat generated by each heating element can be rapidly transferred to the substrate by using the heat conductor with relatively small thermal resistance, and then is dissipated into an external environment from the substrate. This effectively reduces thermal conduction resistance from the heating element to the substrate, and improves heat dissipation efficiency of the heat dissipation apparatus.