COPPER ALLOY SHEET, COPPER ALLOY SHEET WITH PLATING FILM, AND METHOD FOR PRODUCING SAME

• Main Authors: AKISAKA, Yoshiteru, MAKI, Kazunari, FUNAKI, Shinichi, MIYASHIMA, Naoki
• Format: Patent
• Language: English; French; German
• Published: 19.10.2022
• Subjects: ALLOYS; APPARATUS THEREFOR; CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS ANDNON-FERROUS ALLOYS; CHEMISTRY; ELECTROFORMING; ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; FERROUS OR NON-FERROUS ALLOYS; METALLURGY; PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS; TREATMENT OF ALLOYS OR NON-FERROUS METALS

Providing a copper alloy plate, in which center Mg concentration at a center part in a plate thickness direction 0.1 mass% or more and less than 0.3 mass%, center P concentration is 0.001 mass% or more and 0.2 mass% or less, and the balance is composed of Cu and inevitable impurities; in which surface Mg concentration at a surface is 70% or less of the center Mg concentration; in which a surface layer part defined by a prescribed thickness from the surface has a concentration gradient of Mg of 0.05 mass%/µm or more and 5 mass%/µm or less increasing from the surface toward the center part of the plate thickness direction; and in which restraint of color change of the surface and increase of electrical contact resistance, and adhesiveness of a plating film are excellent due to maximum Mg concentration in the surface layer part is 90% of the center Mg concentration.