RESIN COMPOSITION
The present invention is a resin composition, including: an addition polymerization resin α having a glass transition temperature of 150°C or more; and a resin β having an aromatic dicarboxylic acid monomer unit A having a hydrophilic group and a dicarboxylic acid monomer unit B having no hydrophili...
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Main Authors | , |
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Format | Patent |
Language | English French German |
Published |
12.07.2023
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Subjects | |
Online Access | Get full text |
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Summary: | The present invention is a resin composition, including: an addition polymerization resin α having a glass transition temperature of 150°C or more; and a resin β having an aromatic dicarboxylic acid monomer unit A having a hydrophilic group and a dicarboxylic acid monomer unit B having no hydrophilic group. According to the present invention, a resin composition that can be easily removed with water while maintaining the heat resistance can be provided. |
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Bibliography: | Application Number: EP20200900011 |