RESIN COMPOSITION

The present invention is a resin composition, including: an addition polymerization resin α having a glass transition temperature of 150°C or more; and a resin β having an aromatic dicarboxylic acid monomer unit A having a hydrophilic group and a dicarboxylic acid monomer unit B having no hydrophili...

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Bibliographic Details
Main Authors YOSHIMURA, Tadanori, ONOUE, Akihiro
Format Patent
LanguageEnglish
French
German
Published 12.07.2023
Subjects
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Summary:The present invention is a resin composition, including: an addition polymerization resin α having a glass transition temperature of 150°C or more; and a resin β having an aromatic dicarboxylic acid monomer unit A having a hydrophilic group and a dicarboxylic acid monomer unit B having no hydrophilic group. According to the present invention, a resin composition that can be easily removed with water while maintaining the heat resistance can be provided.
Bibliography:Application Number: EP20200900011