EPOXY RESIN COMPOSITION, MOLDING MATERIAL FOR FIBER-REINFORCED COMPOSITE MATERIAL, AND FIBER-REINFORCED COMPOSITE MATERIAL

• Main Authors: TOMIOKA, Nobuyuki, ISHIKAWA, Norikazu, TAKAMOTO, Tatsuya
• Format: Patent
• Language: English; French; German
• Published: 11.09.2024
• Subjects: AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; GENERAL PROCESSES OF COMPOUNDING; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS; WORKING-UP

The purposes of the present invention are: to provide an epoxy resin composition having excellent impregnation into reinforcing fibers, excellent shapability under low-temperature conditions after thickening, and excellent heat resistance after curing; to provide a molding material for a fiber-reinforced composite material, said molding material having excellent shapability during handling and excellent fluidity during press molding; and to provide a fiber-reinforced composite material having excellent heat resistance and bending strength. To achieve the abovementioned purposes, the present invention provides an epoxy resin composition containing all of the following components (A)-(D), wherein: the content of the component (A), in terms of 100 mass% of the total mass of the epoxy resin composition, is 30-95 mass%; and the ratio Wc/Wd of the content Wc of the component (C) to the content Wd of the component (D) is 0.01-10. Component (A) is an epoxy resin; component (B) is a curing agent; component (C) is a diisocyanate compound having consecutive double bonds, an alicyclic structure or a heterocyclic structure; and component (D) is a polyisocyanate compound excluding the component (C).