IMPLANTABLE STIMULATOR WITH AN ELECTRODE ARRAY AND CONFORMABLE SUBSTRATE

The use of neurostimulation leads in the craniofacial region is associated with skin erosion and lead migration. The cylindrical shape and associated thickness of state-of-the-art leads results in the lead eroding through the skin or results in the lead being displaced so that the electrodes no long...

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Bibliographic Details
Main Authors VAN DER ZALM, Maartje, BOERE, Stijn, MARTENS, Hubert, SCHOBBEN, Daniël
Format Patent
LanguageEnglish
French
German
Published 12.10.2022
Subjects
CHEMICAL ASPECTS OF BANDAGES, DRESSINGS, ABSORBENT PADS, ORSURGICAL ARTICLES
DIAGNOSIS
DISINFECTION, STERILISATION, OR DEODORISATION OF AIR
ELECTROTHERAPY
HUMAN NECESSITIES
HYGIENE
IDENTIFICATION
MAGNETOTHERAPY
MATERIALS FOR BANDAGES, DRESSINGS, ABSORBENT PADS, OR SURGICALARTICLES
MEDICAL OR VETERINARY SCIENCE
METHODS OR APPARATUS FOR STERILISING MATERIALS OR OBJECTS INGENERAL
RADIATION THERAPY
SURGERY
ULTRASOUND THERAPY
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Summary:The use of neurostimulation leads in the craniofacial region is associated with skin erosion and lead migration. The cylindrical shape and associated thickness of state-of-the-art leads results in the lead eroding through the skin or results in the lead being displaced so that the electrodes no longer cover the targeted nerves. An implantable stimulator 1001110 is provided having a substrate 300, 1400 comprising a conformable portion with an electrode array, and a pulse generator 500. A plurality of electrical interconnections 250, 1210 are positioned between the surfaces of the substrate The conformable portion has a thickness equal to or less than 0.5 millimeters. Optionally, one or more encapsulation layers 1300 may be provided. Optionally, one or adhesion layers 1500 may also be provided comprising a ceramic material. By providing a more easily patternable substrate, more complicated electrode array configurations may be supported, allowing a higher degree of flexibility to address transverse and/or longitudinal misalignment. By providing a relatively thin implantable electrode array, user comfort may be increased. The one or more adhesion layers improve the performance of the encapsulation.
Bibliography:Application Number: EP20200829652