MULTI-CHIP STACKED DEVICES

• Main Authors: YOUNG, Steven P, GAIDE, Brian C
• Format: Patent
• Language: English; French; German
• Published: 07.09.2022
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

Examples described herein generally related to multi-chip devices having vertically stacked chips. In an example, a multi-chip device includes a chip stack. The chip stack includes a base chip and a plurality of interchangeable chips. The base chip is directly bonded to a first one of the plurality...