MULTI-CHIP STACKED DEVICES

Examples described herein generally related to multi-chip devices having vertically stacked chips. In an example, a multi-chip device includes a chip stack. The chip stack includes a base chip and a plurality of interchangeable chips. The base chip is directly bonded to a first one of the plurality...

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Bibliographic Details
Main Authors YOUNG, Steven P, GAIDE, Brian C
Format Patent
LanguageEnglish
French
German
Published 07.09.2022
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:Examples described herein generally related to multi-chip devices having vertically stacked chips. In an example, a multi-chip device includes a chip stack. The chip stack includes a base chip and a plurality of interchangeable chips. The base chip is directly bonded to a first one of the plurality of interchangeable chips. Each neighboring pair of the plurality of interchangeable chips is directly bonded together in an orientation with a front side of one chip of the respective neighboring pair directly bonded to a backside of the other chip of the respective neighboring pair. Each of the interchangeable chips has a same processing integrated circuit and a same hardware layout. The chip stack can include a distal chip, which can be directly bonded to a second one of the plurality of interchangeable chips.
Bibliography:Application Number: EP20200815978