ONE COMPONENT (1K) CURABLE ADHESIVE COMPOSITION

The present invention is directed to a curable and electrochemically debondable one-component (1K) adhesive composition comprising, based on the weight of the composition:from 40 to 90 wt.% of i) at least one ethylenically unsaturated non-ionic monomer;from 1 to 30 wt.% of ii) non-polymerizable elec...

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Bibliographic Details
Main Authors Sundermeier, Uta, Kamm, Thomas, Stapf, Stefanie, Brunstedt, Benjamin
Format Patent
LanguageEnglish
French
German
Published 31.08.2022
Subjects
ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE
ADHESIVES
CHEMISTRY
COMPOSITIONS BASED THEREON
DYES
MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL
ORGANIC MACROMOLECULAR COMPOUNDS
PAINTS
POLISHES
THEIR PREPARATION OR CHEMICAL WORKING-UP
USE OF MATERIALS AS ADHESIVES
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Summary:The present invention is directed to a curable and electrochemically debondable one-component (1K) adhesive composition comprising, based on the weight of the composition:from 40 to 90 wt.% of i) at least one ethylenically unsaturated non-ionic monomer;from 1 to 30 wt.% of ii) non-polymerizable electrolyte;from 0.1 to 10 wt.% of iii) at least one radical generating thermal initiator;from 0 to 20 wt.% of iv) filler; and,from 0 to 20 wt.% of v) toughener.
Bibliography:Application Number: EP20210159713