INTEGRATED DEVICE COUPLED TO A STEP HEAT SINK CONFIGURED TO PROVIDE SHIELDING

• Main Authors: WANG, Keith, LIN, Hung-Wen, VALLABHANENI, Ajit Kumar, CHANG, Jen-Chun, WANG, Sin-Shong
• Format: Patent
• Language: English; French; German
• Published: 24.08.2022
• Subjects: BASIC ELECTRIC ELEMENTS; CALCULATING; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; COMPUTING; COUNTING; ELECTRIC DIGITAL DATA PROCESSING; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PHYSICS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES

An assembly comprising a substrate, a first integrated device coupled to the substrate, a second integrated device coupled to the substrate, a frame coupled to the substrate such that the frame at least partially surrounds the first integrated device and the second integrated device, and a step heat sink coupled to the frame, such that the step heat sink is located over the first integrated device and the second integrated device. The assembly may further include a shield coupled to the frame such that the shield is located between the frame and the step heat sink. The shield may include a step shield. The assembly may further include a heat pipe coupled to the step heat sink.