INTEGRATED DEVICE COUPLED TO A STEP HEAT SINK CONFIGURED TO PROVIDE SHIELDING

An assembly comprising a substrate, a first integrated device coupled to the substrate, a second integrated device coupled to the substrate, a frame coupled to the substrate such that the frame at least partially surrounds the first integrated device and the second integrated device, and a step heat...

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Bibliographic Details
Main Authors WANG, Keith, LIN, Hung-Wen, VALLABHANENI, Ajit Kumar, CHANG, Jen-Chun, WANG, Sin-Shong
Format Patent
LanguageEnglish
French
German
Published 24.08.2022
Subjects
BASIC ELECTRIC ELEMENTS
CALCULATING
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
COMPUTING
COUNTING
ELECTRIC DIGITAL DATA PROCESSING
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PHYSICS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
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Summary:An assembly comprising a substrate, a first integrated device coupled to the substrate, a second integrated device coupled to the substrate, a frame coupled to the substrate such that the frame at least partially surrounds the first integrated device and the second integrated device, and a step heat sink coupled to the frame, such that the step heat sink is located over the first integrated device and the second integrated device. The assembly may further include a shield coupled to the frame such that the shield is located between the frame and the step heat sink. The shield may include a step shield. The assembly may further include a heat pipe coupled to the step heat sink.
Bibliography:Application Number: EP20200800765