ELECTRICALLY CONDUCTIVE VIAS AND METHODS FOR PRODUCING SAME

An electrical component is provided by metallizing holes that extend through a glass substrate. The electrical component can be fabricated by forcing a suspension of electrically conductive particles suspended in a liquid medium through the holes. The suspension can be forced into the holes under an...

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Main Authors NOLET, Alan, D, OWENS, Adam, MOEN, Lauren, Savawn, HOLLAND, Troy, Benton, HAMMANN, Thomas, Jacob, LIOTTA, Andrew, Haynes, MCGRAW, Nicole, KUMAR, Ajeet, GOIA, Daniel, HARDIKAR, Vishwas, Vnayak, LONG, Daniel, BATES, Heidi
Format Patent
LanguageEnglish
French
German
Published 01.11.2023
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:An electrical component is provided by metallizing holes that extend through a glass substrate. The electrical component can be fabricated by forcing a suspension of electrically conductive particles suspended in a liquid medium through the holes. The suspension can be forced into the holes under an air pressure differential such as a pressure differential force, a centrifugal force, or an electrostatic force. The liquid medium in the holes can be dried, and the particles can be sintered. The particles can further be packed in the hole. Alternatively or additionally, the particles can be pressed against the outer surfaces of the substrate to produce buttons.
Bibliography:Application Number: EP20200872452