PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

Disclosed are a printed circuit board and a method of manufacturing the printed circuit board. The printed circuit board includes an insulating layer, and a circuit pattern formed on the insulating layer, wherein the circuit pattern includes a first portion formed on the insulating layer and includi...

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Bibliographic Details
Main Authors LEE, Jin Hak, JEONG, In Ho, SON, Kil Dong, JEON, Jae Hoon, HWANG, Jung Ho, KWON, Soon Gyu, LEE, Han Su, LEE, Sang Young, BAE, Yun Mi, CHOI, Dae Young, JEONG, Dong Hun, KIM, Sang Hwa
Format Patent
LanguageEnglish
French
German
Published 10.08.2022
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Summary:Disclosed are a printed circuit board and a method of manufacturing the printed circuit board. The printed circuit board includes an insulating layer, and a circuit pattern formed on the insulating layer, wherein the circuit pattern includes a first portion formed on the insulating layer and including a corner portion of an upper portion which has a predetermined curvature and a second portion formed on the first portion and configured to cover an upper surface of the first portion including the corner portion.
Bibliography:Application Number: EP20220157740