BACKPLATE AND GLASS-BASED CIRCUIT BOARD

• Main Authors: HAO, Wei, SHI, Rui, SUN, Haiwei, SHI, Lingyun, SU, Wengang, WANG, Feifei
• Format: Patent
• Language: English; French; German
• Published: 19.10.2022
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; DEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH ISMODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THEDEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY,COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g.SWITCHING, GATING, MODULATING OR DEMODULATING; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; FREQUENCY-CHANGING; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; NON-LINEAR OPTICS; OPTICAL ANALOGUE/DIGITAL CONVERTERS; OPTICAL LOGIC ELEMENTS; OPTICS; PHYSICS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES; TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF

A backplane and a glass-based circuit board. The backplane includes: a base substrate (100) and a plurality of light-emitting units (110), arranged in an array on the base substrate (100). Each of the light-emitting units (110) includes at least one light-emitting sub-unit (101); the light-emitting sub-unit (101) includes a connection line (200) and a plurality of light-emitting diode chips (300) connected with the connection line (200), and the light-emitting diode chips (300) are located on a side of the connection line (200) away from the base substrate (100). The light-emitting diode chips (300) in the at least one light-emitting sub-unit (101) are connected in series. In the embodiment of the present disclosure, the connection line unit is used to connect the light-emitting diode chips in the light-emitting sub-unit in series, which can increase space utilization of the backplane and reduce driving costs.