SENSOR PACKAGE AND METHOD FOR ATTACHING SENSOR PACKAGE

• Main Authors: KIRA Yoshiko, FUKUMOTO Shintaro, NISHIDO Takayuki, TANAKA Akiko, ISHIGURO Shigeki, IMAGAWA Shun
• Format: Patent
• Language: English; French; German
• Published: 18.10.2023
• Subjects: ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVEREDIN A SINGLE OTHER SUBCLASS; MEASURING; MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR; PHYSICS; TARIFF METERING APPARATUS; TESTING

The present invention relates to a sensor package to be attached to an object, and the sensor package includes: a first substrate; an FBG sensor; a resin portion and a first pressure-sensitive adhesive layer positioned on the first substrate; and an adhesive layer positioned on a surface of the resi...