SENSOR PACKAGE AND METHOD FOR ATTACHING SENSOR PACKAGE

The present invention relates to a sensor package to be attached to an object, and the sensor package includes: a first substrate; an FBG sensor; a resin portion and a first pressure-sensitive adhesive layer positioned on the first substrate; and an adhesive layer positioned on a surface of the resi...

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Bibliographic Details
Main Authors KIRA Yoshiko, FUKUMOTO Shintaro, NISHIDO Takayuki, TANAKA Akiko, ISHIGURO Shigeki, IMAGAWA Shun
Format Patent
LanguageEnglish
French
German
Published 18.10.2023
Subjects
ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVEREDIN A SINGLE OTHER SUBCLASS
MEASURING
MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE
MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
PHYSICS
TARIFF METERING APPARATUS
TESTING
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Summary:The present invention relates to a sensor package to be attached to an object, and the sensor package includes: a first substrate; an FBG sensor; a resin portion and a first pressure-sensitive adhesive layer positioned on the first substrate; and an adhesive layer positioned on a surface of the resin portion on a side opposite to the first substrate, in which the FBG sensor is held by the resin portion.
Bibliography:Application Number: EP20200864456