SENSOR PACKAGE AND METHOD FOR ATTACHING SENSOR PACKAGE

The present invention relates to a sensor package to be attached to an object, and the sensor package includes: a first substrate; an FBG sensor; a resin portion and a first pressure-sensitive adhesive layer positioned on the first substrate; and an adhesive layer positioned on a surface of the resi...

Full description

Saved in:
Bibliographic Details
Main Authors KIRA Yoshiko, FUKUMOTO Shintaro, NISHIDO Takayuki, TANAKA Akiko, ISHIGURO Shigeki, IMAGAWA Shun
Format Patent
LanguageEnglish
French
German
Published 18.10.2023
Subjects
ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVEREDIN A SINGLE OTHER SUBCLASS
MEASURING
MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE
MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
PHYSICS
TARIFF METERING APPARATUS
TESTING
Online AccessGet full text

Cover

Abstract The present invention relates to a sensor package to be attached to an object, and the sensor package includes: a first substrate; an FBG sensor; a resin portion and a first pressure-sensitive adhesive layer positioned on the first substrate; and an adhesive layer positioned on a surface of the resin portion on a side opposite to the first substrate, in which the FBG sensor is held by the resin portion.
AbstractList The present invention relates to a sensor package to be attached to an object, and the sensor package includes: a first substrate; an FBG sensor; a resin portion and a first pressure-sensitive adhesive layer positioned on the first substrate; and an adhesive layer positioned on a surface of the resin portion on a side opposite to the first substrate, in which the FBG sensor is held by the resin portion.
Author NISHIDO Takayuki
TANAKA Akiko
KIRA Yoshiko
ISHIGURO Shigeki
FUKUMOTO Shintaro
IMAGAWA Shun
Author_xml – fullname: KIRA Yoshiko
– fullname: FUKUMOTO Shintaro
– fullname: NISHIDO Takayuki
– fullname: TANAKA Akiko
– fullname: ISHIGURO Shigeki
– fullname: IMAGAWA Shun
BookMark eNrjYmDJy89L5WQwC3b1C_YPUghwdPZ2dHdVcPRzUfB1DfHwd1FwAwo7hoQ4Ont4-rkroKrjYWBNS8wpTuWF0twMCm6uIc4euqkF-fGpxQWJyal5qSXxrgEmBsbGRoYGjibGRCgBAKAhKN0
ContentType Patent
DBID EVB
DatabaseName esp@cenet
DatabaseTitleList
Database_xml – sequence: 1
  dbid: EVB
  name: esp@cenet
  url: http://worldwide.espacenet.com/singleLineSearch?locale=en_EP
  sourceTypes: Open Access Repository
DeliveryMethod fulltext_linktorsrc
Discipline Medicine
Chemistry
Sciences
Physics
DocumentTitleAlternate BOÎTIER DE CAPTEUR ET PROCÉDÉ DE FIXATION D'UN BOÎTIER DE CAPTEUR
SENSORPAKET UND VERFAHREN ZUR BEFESTIGUNG EINES SENSORPAKETS
ExternalDocumentID EP4033210A4
GroupedDBID EVB
ID FETCH-epo_espacenet_EP4033210A43
IEDL.DBID EVB
IngestDate Fri Nov 01 05:35:34 EDT 2024
IsOpenAccess true
IsPeerReviewed false
IsScholarly false
Language English
French
German
LinkModel DirectLink
MergedId FETCHMERGED-epo_espacenet_EP4033210A43
Notes Application Number: EP20200864456
OpenAccessLink https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20231018&DB=EPODOC&CC=EP&NR=4033210A4
ParticipantIDs epo_espacenet_EP4033210A4
PublicationCentury 2000
PublicationDate 20231018
PublicationDateYYYYMMDD 2023-10-18
PublicationDate_xml – month: 10
  year: 2023
  text: 20231018
  day: 18
PublicationDecade 2020
PublicationYear 2023
RelatedCompanies NITTO DENKO CORPORATION
IHI Inspection and Instrumentation Co., Ltd
RelatedCompanies_xml – name: IHI Inspection and Instrumentation Co., Ltd
– name: NITTO DENKO CORPORATION
Score 3.4932933
Snippet The present invention relates to a sensor package to be attached to an object, and the sensor package includes: a first substrate; an FBG sensor; a resin...
SourceID epo
SourceType Open Access Repository
SubjectTerms ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVEREDIN A SINGLE OTHER SUBCLASS
MEASURING
MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE
MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
PHYSICS
TARIFF METERING APPARATUS
TESTING
Title SENSOR PACKAGE AND METHOD FOR ATTACHING SENSOR PACKAGE
URI https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20231018&DB=EPODOC&locale=&CC=EP&NR=4033210A4
hasFullText 1
inHoldings 1
isFullTextHit
isPrint
link http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwfV1LT8MwDLbGeN6ggBgv5YB2q-jatKWHCnVpygRaW20F7TbNbSft0k2siL9PEnUDDnCLnChyLH127NgxwJ2JKPujCbcEnblObfR0pA7qdm6ZuYku9QqVbRE7g1f6PLEnLVhsamHUP6Gf6nNEgahc4L1W-nr1HcQKVW7l-h4XgrR8jDI_7DbesbysCDiHfZ-nSZiwLmNi1I1HPjUsWa0S0B3YFbdoV4KBv_VlUcrqp0WJjmEvFZtV9Qm0ykqDQ7ZpvKbBwbB579ZgXyVo5mtBbEC4PgVnzONxMiJpwF6CJ06COCRDng2SkAiXjgRZFjAZhCK_150BiXjGBrpgZbo99pSnW6atc2hXy6q8AGLMZwX2crNwi4LOEdGx0MbS61mla-TmrAOdP7e5_GfuCo6k_KRa7j1cQ7t-_yhvhL2t8VZJ6gufen8q
link.rule.ids 230,309,783,888,25576,76882
linkProvider European Patent Office
linkToHtml http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwfR3LTsJAcIL4wJuiRnzuwfTWCO22yIGYsl2sAm0D1XBrmLYkXAqRGn_f3U1BPehtM7uZzE4yO4-dB8CdgSjnowm3BO25Ti3s6Eht1K3ENBID27STqmwL3_Ze6cvUmlZgsamFUX1CP1VzRCFRiZD3Qr3Xq-8glqtyK9f3uBCg5WM_6rpa6R1LY0WIs9vr8jBwA6YxJlaaP-7SpimrVRy6A7vCwn6Qww74W08Wpax-apT-EeyFAlleHEMly-tQY5vBa3U4GJX_3XXYVwmayVoASyFcn4A94f4kGJPQYQPniRPHd8mIR17gEuHSESeKHCaDUOT3uVMgfR4xTxekxNtrxzzcEm2eQTVf5tk5kOZ8lmIrMdJ2mtI5ItomWph1WmbWbibGrAGNP9Fc_LN3CzUvGg3j4bM_uIRDyUuZamW0rqBavH9k10L3FnijuPYFvciCFg
openUrl ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Apatent&rft.title=SENSOR+PACKAGE+AND+METHOD+FOR+ATTACHING+SENSOR+PACKAGE&rft.inventor=KIRA+Yoshiko&rft.inventor=FUKUMOTO+Shintaro&rft.inventor=NISHIDO+Takayuki&rft.inventor=TANAKA+Akiko&rft.inventor=ISHIGURO+Shigeki&rft.inventor=IMAGAWA+Shun&rft.date=2023-10-18&rft.externalDBID=A4&rft.externalDocID=EP4033210A4