PRESSURE SENSITIVE ADHESIVE ARTICLE

Provided is a pressure sensitive adhesive article comprising (a) a substrate (Sa) (b) in contact with the substrate (Sa), a layer (Lb) of a pressure sensitive composition (Cb) that comprises one or more acrylic polymer (POLb) having Tg of 20° C. or lower, and (c) in contact with the layer (Lb), a la...

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Bibliographic Details
Main Authors GRIFFITH, JR., William B, PUJARI, Saswati
Format Patent
LanguageEnglish
French
German
Published 27.07.2022
Subjects
ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE
ADHESIVES
CHEMISTRY
COMPOSITIONS BASED THEREON
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
DYES
MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL
ORGANIC MACROMOLECULAR COMPOUNDS
PAINTS
POLISHES
THEIR PREPARATION OR CHEMICAL WORKING-UP
USE OF MATERIALS AS ADHESIVES
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Summary:Provided is a pressure sensitive adhesive article comprising (a) a substrate (Sa) (b) in contact with the substrate (Sa), a layer (Lb) of a pressure sensitive composition (Cb) that comprises one or more acrylic polymer (POLb) having Tg of 20° C. or lower, and (c) in contact with the layer (Lb), a layer (Lc) that comprises, (i) one or more acrylic polymer (POLc) having Tg of 20° C. or lower, and (ii) one or more olefin copolymer. Also provided are a method of making the pressure sensitive adhesive article and a bonded article made by using the pressure sensitive adhesive article.
Bibliography:Application Number: EP20200781215