ADHESIVE COMPOSITION

The present disclosure provides an adhesive composition. The adhesive composition contains (A) multi-stage latex polymer particles, (B) a linear diamine base, and (C) an ethoxylated surfactant. The (A) multi-stage latex polymer particles include (i) a first-stage polymer containing acrylic acid mono...

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Bibliographic Details
Main Authors JANCO, Miroslav, RAY, Himal H, NUNGESSER, JR., Edwin Aloysius, LAFLEUR, Edward E
Format Patent
LanguageEnglish
French
German
Published 13.07.2022
Subjects
ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE
ADHESIVES
CHEMISTRY
DYES
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL
PAINTS
POLISHES
USE OF MATERIALS AS ADHESIVES
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Summary:The present disclosure provides an adhesive composition. The adhesive composition contains (A) multi-stage latex polymer particles, (B) a linear diamine base, and (C) an ethoxylated surfactant. The (A) multi-stage latex polymer particles include (i) a first-stage polymer containing acrylic acid monomer and a first vinyl monomer, and (ii) a second-stage polymer containing a meth acrylic acid monomer and a second vinyl monomer, with the proviso that the second vinyl monomer is different than the meth acrylic acid monomer. The first-stage polymer is bound to the second-stage polymer.
Bibliography:Application Number: EP20200768828