APPARATUS AND METHOD FOR EVACUATED INJECTION REPAIR OF BONDLINE VOIDS AND BONDLINE VOID REPAIRED BY SAID METHOD

In an example, a method is described. The method comprises forming a single hole (216) into a bond gap repair area (118). The method also comprises evacuating, via an adhesive injection apparatus (200) attached to the single hole (216), the bond gap repair area (118) and an injection channel (206) o...

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Bibliographic Details
Main Authors HAFENRICHTER, Joseph L, GEORGESON, Gary E, PIEHL, Marc J
Format Patent
LanguageEnglish
French
German
Published 03.01.2024
Subjects
AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
AIRCRAFT
AVIATION
COSMONAUTICS
DESIGNING, MANUFACTURING, ASSEMBLING, CLEANING, MAINTAINING ORREPAIRING AIRCRAFT, NOT OTHERWISE PROVIDED FOR
GROUND OR AIRCRAFT-CARRIER-DECK INSTALLATIONS SPECIALLYADAPTED FOR USE IN CONNECTION WITH AIRCRAFT
HANDLING, TRANSPORTING, TESTING OR INSPECTING AIRCRAFTCOMPONENTS, NOT OTHERWISE PROVIDED FOR
PERFORMING OPERATIONS
SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR
SHAPING OR JOINING OF PLASTICS
TRANSPORTING
WORKING OF PLASTICS
WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Summary:In an example, a method is described. The method comprises forming a single hole (216) into a bond gap repair area (118). The method also comprises evacuating, via an adhesive injection apparatus (200) attached to the single hole (216), the bond gap repair area (118) and an injection channel (206) of the adhesive injection apparatus (200). The method also comprises forcing adhesive (205) through the evacuated injection channel (206) and into the evacuated bond gap repair area (118).
Bibliography:Application Number: EP20210210870